For orders of 50 units or more, every SZO product can ship under your own brand — your logo etched on the chassis, your part numbers on every label, your packaging design, your spec sheets. ShenzhenOPS does not appear anywhere in your end customer's experience. NDA signed before any specification exchange.
If you're trying to figure out which tier matches your project, this matrix answers the most common questions buyers ask in initial scoping calls.
| Customization | Tier 1 50+ units |
Tier 2 100+ units |
Tier 3 500+ units |
|---|---|---|---|
| Chassis & Hardware | |||
| Logo printed/sticker on chassis | ✓ | ✓ | ✓ |
| Laser-etched logo on chassis | – | ✓ | ✓ |
| Custom chassis color/finish | – | ✓+$8–15/unit | ✓ |
| Custom chassis dimensions/shape | – | – | ✓Tooling fee |
| Custom I/O port configuration | – | – | ✓ |
| Custom motherboard layout | – | – | ✓NRE fee |
| Thermal design (fanless, wide-temp) | – | ✓Limited options | ✓ |
| SKU & Labels | |||
| Custom SKU / part number | ✓ | ✓ | ✓ |
| Custom serial number format | – | ✓ | ✓ |
| Custom barcode / 2D code | ✓ | ✓ | ✓ |
| Sequential serial blocks (your prefix) | – | ✓ | ✓ |
| Packaging & Documentation | |||
| Re-stickered shipping label | ✓ | ✓ | ✓ |
| Custom color box (your design) | – | ✓ | ✓ |
| Custom foam / insert tray | – | ✓ | ✓ |
| Custom user manual (your brand) | – | ✓ | ✓ |
| Multi-language documentation | – | ✓Up to 4 lang | ✓Unlimited |
| Quick-start guide & cards | – | ✓ | ✓ |
| Software & Firmware | |||
| Pre-installed Windows / Linux image | ✓Standard image | ✓Your image | ✓ |
| Pre-loaded applications & drivers | – | ✓ | ✓ |
| Custom desktop / wallpaper | – | ✓ | ✓ |
| Custom BIOS branding & boot logo | – | – | ✓ |
| Custom Android ROM (tablets) | – | ✓ | ✓ |
| MDM-ready provisioning | – | ✓ | ✓ |
| Certification & Compliance | |||
| Ship under factory cert + your re-label | ✓ | ✓ | ✓ |
| New CE / FCC under your brand | – | ✓+$1,500–4,000 | ✓ |
| New EAC under your brand (Russia) | – | ✓+$3,000–6,000 | ✓ |
| Local-market certifications (BIS, SASO, etc.) | – | ✓ | ✓ |
| Commercial & IP | |||
| Mutual NDA signed pre-spec | ✓ | ✓ | ✓ |
| Brand exclusivity (your name) | ✓ | ✓ | ✓ |
| Geographic exclusivity | – | ✓Vol commitment | ✓ |
| Hardware-design exclusivity (no resale) | – | – | ✓ |
| Dedicated production line slot | – | – | ✓ |
You share volume target, branding direction, target markets, certification needs, and any specific hardware requirements. NDA signed before we exchange any specifications.
Quote within 48 hours. For Tier 2/3 projects, we prepare branded mockups of chassis etching, packaging artwork concepts, and documentation samples.
1–3 sample units with your branding for your engineering, marketing, and certification teams to evaluate. Shipped via DHL/FedEx.
30% T/T deposit (or LC at sight for large orders) triggers production. Components are reserved in dedicated batch. Pre-production engineering checkpoints with you.
Multi-stage QC: incoming materials, in-process line checks, finished-unit testing, packaging inspection. Optional 3rd-party inspection by SGS/BV/TÜV.
70% balance against B/L copy. FOB Shenzhen, CIF, or DDP shipping. 2-year warranty with RMA handled through Vincent personally.
QC isn't a single end-of-line check. Every order passes through four independent quality checkpoints before leaving the factory.
Every component batch (CPUs, RAM, SSDs, chassis parts) is sampled and tested on arrival. Defective batches are returned to component supplier before they enter production.
Line inspectors verify assembly correctness at each station: solder joints, screw torque, cable routing, thermal paste application, gasket seating. AQL 0.65 sampling on non-critical defects.
100% of finished units undergo automated functional test: CPU stress (4-hour minimum), memory test, all I/O ports verified, WiFi/BT/cellular validated, screen pixel check (tablets/laptops).
Before container loading, we photograph the actual production batch and send to you for review. You confirm or flag issues before final shipment. Optional 3rd-party inspection (SGS/BV/TÜV) for orders 200+ units.
Three representative customer projects from 2024-2025. Names withheld per NDA; configurations and outcomes are real.
A regional education ministry in Russia engaged us for a multi-year IFP refresh project covering 180 schools. The buyer required EAC certification re-issued under their own ministry brand (not under factory name), Cyrillic-language quick-start guides in the box, and a sequential serial number scheme integrated with their existing asset management system.
Production was phased into three waves over 18 months to match the ministry's deployment calendar. Each wave used a custom export packing list with the ministry's procurement codes embedded in the documentation. The end customer (schools and teachers) had no visibility into the underlying manufacturing relationship.
A Brazilian electrical utility deployed 600 rugged 10.1″ Windows tablets to field technicians for line inspection, fault reporting, and customer-facing service. The deal-clinching customizations were specific: utility brand laser-etched on the back, custom desktop wallpaper showing the utility's logo and emergency hotline, pre-installed inspection app with offline mode, and SOTI MobiControl MDM enrollment automated via QR-code provisioning.
RS-232 was required for connecting to legacy field-test equipment from a competitor's older fleet — that's the kind of detail commodity suppliers miss. The customer also needed the tablets shipped with Brazilian Portuguese as default OS language and Anatel (Brazilian regulator) certification under their own brand. Delivered in 12 weeks; second order of 400 follow-up units placed within 6 months.
A regional display brand in the UAE wanted an OPS-spec module that none of their competitors could buy. We engineered a custom motherboard with extra serial ports (their existing CMS required this), a chassis with their distinctive vent pattern, BIOS branding so even POST shows their logo, and contractual geographic exclusivity in their GCC territory for 3 years.
This was a Tier 3 ODM project. NRE (non-recurring engineering) fee of $24,000 covered tooling and certification. Recurring production runs against firm 12-month rolling forecasts; the customer commits to 2,000 units/year minimum, we commit to capacity and exclusivity. Now in year 2 of the arrangement; the customer's signage products are competing successfully against tier-1 brands at 35% lower price.
50 units for Tier 1 (logo on chassis + custom SKU labels) with standard SZO packaging re-stickered. 100 units for Tier 2 (full white-label with custom-printed packaging and your documentation). 500 units for Tier 3 (custom hardware variants).
For sub-50 unit orders we ship under the SZO brand. For 30–49 unit pilots considering future white-label, we offer a "pilot with branded sticker overlay" arrangement so you can validate market response before committing to full custom production.
First-time Tier 2 white-label runs take 35–55 days from deposit to shipment. The first run includes 7–14 days for design proofing of your branding (logo placement on chassis, packaging artwork, documentation typography). Most of the surprise time comes here, not in actual manufacturing.
Repeat orders without design changes run on the standard 20–30 day production timeline. Tier 3 ODM first runs are 60–90 days due to motherboard and chassis tooling.
Yes — three paths:
Path 1 (most common): We ship under existing factory EAC/CE/FCC certification with your brand re-labeled on top. Acceptable for most countries; some Russian customs officers occasionally ask about cert chain.
Path 2: We help you obtain fresh CE/FCC/EAC certification under your brand. Adds 4–8 weeks (depending on cert body) and $1,500–6,000 per certification. Only needed once per product family.
Path 3: If you already hold certifications for similar products under your brand, we can manufacture against your existing cert. Requires careful coordination on product specifications.
No. NDAs prohibit reuse of: your branding assets (logo, custom artwork), your SKU naming scheme, your custom design elements (Tier 3), your customer information, and any specific technical specifications you've requested as a custom configuration.
Standard SZO products that you privately re-label under Tier 1 don't carry exclusivity by default — but exclusive geographic arrangements can be negotiated for committed annual volumes (typically 1,000+ units/year).
Tier 3 ODM projects with custom hardware get full hardware-design exclusivity by default.
Standard: 30% T/T deposit, 70% before shipment (against B/L copy or after pre-shipment QC photo approval).
For repeat customers with track record, we offer 30/70 against B/L. LC at sight available for orders over $50K USD with established track record. For sustained Tier 3 ODM relationships, we offer 30/60/10 with the final 10% as retention released after delivery confirmation.
Payment routes supported: USD via Hong Kong banking, Yuan (CNY) direct, UAE Dirham via Dubai entities, Euro for EU customers, and USDT for established crypto-comfortable customers.
Yes. For orders over 200 units, on-site visits to partner factories in Shenzhen are arranged on request. We accompany you for translation and technical liaison. 1 hour from Hong Kong border, 45 minutes from Shenzhen Bao'an airport.
For smaller orders or if travel isn't practical, we arrange remote video walkthroughs of the production line during your batch. Some customers prefer this — it's actually a better view than the in-person visit because we can move the camera close to specific operations.
Standard: 2-year warranty covering manufacturing defects. RMA flow: customer ships defective units to ShenzhenOPS Shenzhen at customer's cost (typically air freight under $50 for small modules); repaired/replaced and sent back at our cost.
For 100+ unit deployments: Spare board stocking at distributor warehouse on volume commitments. Pre-positioned replacement units in your regional warehouse cut field replacement time to 24 hours.
For Tier 3 ODM: Dedicated aftersales engineer responsible for your account. Quarterly review calls. Priority RMA turnaround under 14 days from receipt.
Tier 3 ODM projects with custom motherboard design, custom chassis tooling, or other hardware-level customization carry NRE fees. Typical ranges:
Custom BIOS branding: $1,500–3,000 (one-time)
Custom chassis tooling (modify existing): $8,000–15,000
Full custom chassis design: $25,000–60,000
Custom motherboard layout: $35,000–120,000 depending on complexity
NRE is amortized over the first production run. For committed multi-year relationships, NRE can be partially or fully waived against volume commitments.
If you already have a direct relationship with one of our partner factories under your own distributor account, we can flag this in our quotation and let you continue that existing relationship for the production side while still using ShenzhenOPS for export service, branding, packaging, and aftersales. This is unusual but we've done it for two customers transitioning their relationship.
More common: customers who tried direct-factory and want to switch to a single-point-of-contact arrangement consolidate everything through us.
For Tier 2/Tier 3 projects, we commit to minimum 5-year SKU availability from first shipment date for hardware customizations. If a critical component (Intel CPU, specific WiFi chipset) goes EOL during that window, we engineer a drop-in replacement and re-certify if needed at our cost.
For Tier 1 (standard SZO products with your label), we follow our standard SZO product roadmap. Major hardware generations are guaranteed 3-year availability minimum.
Four layers:
Contractual: NDA signed before any spec exchange, with explicit clauses covering your branding, SKU scheme, customer information, and any custom designs.
Operational: Tier 3 custom hardware projects run on dedicated production line slots, segregated from other customer work. Custom tooling stays in our possession.
Process: Engineering files for custom designs are stored encrypted on our internal systems with access limited to project leads. We do not share files between customer accounts even when customers have overlapping requirements.
Strategic: ShenzhenOPS doesn't compete with our white-label customers in their markets. We don't run direct-to-consumer sales channels, no Alibaba storefronts, no Amazon listings under our brand in your territory.
You're not locked in. Our terms don't include lockout clauses or penalty fees for switching. Open orders run to completion at agreed prices; future orders aren't obligated.
For Tier 3 projects with custom NRE: the NRE buys you the engineering work, not exclusivity from us. Tooling we created stays with us, but if you've paid full NRE you can request transferable engineering files for hardware you've co-designed (case-by-case basis covered in the Tier 3 contract).
Send a quick message describing your volume, branding direction, and target market. Vincent responds within 24 hours with a clear next step — usually a 45-minute discovery call before any spec exchange.